UX-5 & UX-7 Series
Large Field Stepper
Ushio provides specialized steppers for cutting-edge packaging applications employed in servers and PCs, and in portable devices such as smart phones and tablet PCs. The stepper is intended for package substrates using a stage corresponding to the panel size and Ushio’s proprietary large-area projection lens technology cultivated from many years of expertise in light source and optical technology. High productivity is achieved while realizing the high resolution and overlay accuracy required for the latest packaging substrates.
– Includes the world’s best-selling super high-pressure UV lamp
– Ushio’s irradiation optical system boasts a high degree of uniformity
– Unrivaled large-area projector lens
- Semiconductor post-processing
- TSV bottom hole
- Printed circuit board
Features & Benefits
- Proprietary TTL non-exposure wavelength alignment system
When observing mask marks using Ushio’s patented “TTL non-exposure wavelength alignment” technology, exposure up to the alignment marks of the substrate is unnecessary. In addition, since work marks can be directly observed, there is no reduction in contrast due to masks, enabling accurate alignment using clear marks.
- Suits a variety of alignment marks
“Pattern matching support” for registered patterns does not require particular alignment marks, alignment can be achieved through a variety of wiring patterns.
- High resolution
High resolution is obtained by using Ushio’s projection lens for the “UPL series”. Line-space = 5μm design rule full-scale mass production support.
- Long depth of field
Due to the long depth of field (±50 to ±100), even if differences in levels, warpage or unevenness in the board cause focal deviation, the pattern profile equivalent to the profile in focus is obtained. This feature is particularly effective when exposure is performed for a thick, dry film or solder resist.
- High-speed step-and-repeat by surface stages
Precision air bearings are used to reduce friction, and a plane motor configuration is used to reduce the weight of all moving parts and increase their rigidity. As a result, it is possible to perform high-speed step-and-repeat operations. In addition, the surface stage exerts feedback control using a laser interferometer. Consequently, high-speed operations, as well as superior positioning accuracy, can be achieved.
- Elimination of mask damage
Since this is a non-contact projection exposure system, the mask and workpiece do not come into direct contact. Accordingly, the attached resist does not damage the mask. This not only prevents wiring pattern defects but also makes it possible to use the mask semipermanently, reducing running costs. Moreover, since the mask requires no cleaning, we expect improved equipment utilization compared to close contact exposure systems.
- High overlay accuracy maintained despite board expansion and contraction
The “auto scale function” corrects the projection magnification by automatically changing the magnification up to 0.1% according to the expansion or contraction, greatly reducing the deviation in alignment.
|Model||Exposure Area||Substrate Size||Resolution||Alignment Accuracy||Throughput||Wavelength|
|UX-5782SC||□250 mm||Max. 510 × 610 mm||8 µm L/S||±8 µm||120 panels/h||i line|
|UX-5781SC||□250 mm||Max. 510 × 610 mm||16 µm L/S||±8 µm||90 panels/h||ih line|
|UX-5793SC||□140 mm||Max. 510 × 610 mm||3 µm L/S||±5.5 µm||95 panels/h||i line|
Supports Future Design Rules
Supports Substrate Shrinkage
Large Depth of Focus
|Model||Exposure Area||Mask Size||Wafer Size||Substrate Size||Resolution||Alignment Accuracy|
|UX-74101SC||□70×70 mm / d100mm||□6 inches||8 and 12 inch dia.||to 300×300 mm||2 µm L/S||±1.0 µm (front side)|
Resolution: 2 µm L/S Possible
Resist Thickness: 5 µm
Resolution: 2 µm L/S
Focus: ±16 µm