Introducing the Compact High-Power LED EDCC Family Release
Ushio Inc. is proud to announce the development of a new high-power LED package called the “EDCC Family,” designed with a focus on compactness and high-density integration. Production of the EDCC Family is set to commence in the first quarter of 2024.
The EDCC Family incorporates traditional high-power LED chips with a wide range of wavelength options, yet it achieves an impressive reduction in footprint of approximately 80% when compared to the previous small-sized EDC Family package. As a result, it offers a compact form factor (W1.5 x L1.85 x H0.9 mm) that closely resembles bare chips and is also compatible with CSP (Chip Scale Package) and other compact-sized packages. This ensures not only ease of customization but also the convenience of handling SMD (Surface Mount Device) packages.
Key Features:
- Utilizes high-power LED chips with a wide wavelength range, including UV, visible light, IR, and SWIR, similar to those used in the SMBB Family and EDC Family.
- Compact-sized package, comparable to CSP and high-power LED chips, facilitating easy customization in an SMD-type LED format.
- Package design optimized for high-density integration.
Applications:
The EDCC Family is suitable for a wide range of applications that require high brightness, high output, and the combination of multiple wavelengths, including but not limited to:
- Machine Vision
- Optical Sorting
- Plant Growth
- Security
- Surveillance Cameras
- Optical Authentication
- Inspection Equipment
- Vital Sensing and more.
Comparison with conventional products
| SMBB Flat | EDC Flat | EDCC | |
| Package area(mm) | 5.0×5.2 | 3.5×3.5 | 1.5×1.85 (80% reduction compared to EDC Family) |
| Appearance |  |  |  |
Comparison
| SMBB850DS-1100 | EDC850DS-1100 | EDCC850DS-1100 | ||
| Vf[V]@1A | 3.2 | 3.2 | 3.2 | |
| Vfp[V]@5A* | 4.6 | 4.6 | 4.6 | |
| Po[W]@1A | 1.4 | 1.4 | 1.2 | |
| Po[W]@5A* | 5.6 | 5.6 | 5.3 | |
| Rthjs[K/W] | 9 | 11 | 21 | |
| φ1/2[deg.] | 64 | 66 | Long** | 69 |
| Short** | 66 | |||
*Pulse Condition: On Time 10us, Duty 1%
**Radiation Characteristics of EDCC Package
Package Design Optimized for High-Density Integration
The EDCC Family features a package design specifically tailored for high-density integration.
When EDCC packages are arranged in a 2 x 2 configuration, they fit within a compact 4mm x 3.2mm footprint, offering a package size nearly equivalent to the EDC package. Even when arranged in a 2 x 3 configuration, the total footprint remains compact at 4mm x 4.9mm, surpassing the SMBB package in terms of package area efficiency.
Example of LED placement
Recommended Land Pattern/Metal Mask Aperture Pattern
Release Date
| Category | Range | Release Date |
| UV | 365nm-420nm | TBD |
| Visible | 430nm-680nm | 2024 1Q |
| NIR | 690nm-980nm | 2024 1Q |
| SWIR | 1050nm-1900nm | 2024 1Q |
Engineering Sample List
Single Junction Type
670nm: EDCC670D-1100-X
700nm: EDCC700D-1100-X
720nm: EDCC720D-1100-X
740nm: EDCC740D-1100-X
760nm: EDCC760D-1100-X
780nm: EDCC780D-1100-X
810nm: EDCC810D-1100-X
850nm: EDCC850D-1100-X
890nm: EDCC890D-1100-X
910nm: EDCC910D-1100-X
940nm: EDCC940D-1100-X
970nm: EDCC970D-1100-X
1050nm: EDCC1050GD-1100-X
1070nm: EDCC1070D-1100-X
1100nm: EDCC1100D-1100-X
1150nm: EDCC1150D-1100-X
1200nm: EDCC1200D-1100-X
1300nm: EDCC1300D-1100-X
1370nm: EDCC1370D-1100-X
1450nm: EDCC1450D-1100-X
1550nm: EDCC1550D-1100-X
1650nm: EDCC1650D-1100-X
1900nm: EDCC1900D-1100-X
Dual Junction Series
810nm: EDCC810DS-1100-X
850nm: EDCC850DS-1100-X
890nm: EDCC890DS-1100-X
940nm: EDCC940DS-1100-X
970nm: EDCC970DS-1100-X
* Models with “-X” in their part numbers are exclusive to prototypes and engineering samples, and the part numbers will change for mass production.
* Please note that this product is under development and may be subject to changes and modifications without prior notice.
Product and Engineering Sample Inquiries
We have a limited quantity of engineering samples available for the EDCC package.
For inquiries, please contact us here.