Introducing the Compact High-Power LED EDCC Family Release
Ushio Inc. is proud to announce the development of a new high-power LED package called the “EDCC Family,” designed with a focus on compactness and high-density integration. Production of the EDCC Family is set to commence in the first quarter of 2024.
The EDCC Family incorporates traditional high-power LED chips with a wide range of wavelength options, yet it achieves an impressive reduction in footprint of approximately 80% when compared to the previous small-sized EDC Family package. As a result, it offers a compact form factor (W1.5 x L1.85 x H0.9 mm) that closely resembles bare chips and is also compatible with CSP (Chip Scale Package) and other compact-sized packages. This ensures not only ease of customization but also the convenience of handling SMD (Surface Mount Device) packages.
- Utilizes high-power LED chips with a wide wavelength range, including UV, visible light, IR, and SWIR, similar to those used in the SMBB Family and EDC Family.
- Compact-sized package, comparable to CSP and high-power LED chips, facilitating easy customization in an SMD-type LED format.
- Package design optimized for high-density integration.
The EDCC Family is suitable for a wide range of applications that require high brightness, high output, and the combination of multiple wavelengths, including but not limited to:
- Machine Vision
- Optical Sorting
- Plant Growth
- Surveillance Cameras
- Optical Authentication
- Inspection Equipment
- Vital Sensing and more.
Comparison with conventional products
|SMBB Flat||EDC Flat||EDCC|
(80% reduction compared to EDC Family)
*Pulse Condition: On Time 10us, Duty 1%
**Radiation Characteristics of EDCC Package
Package Design Optimized for High-Density Integration
The EDCC Family features a package design specifically tailored for high-density integration.
When EDCC packages are arranged in a 2 x 2 configuration, they fit within a compact 4mm x 3.2mm footprint, offering a package size nearly equivalent to the EDC package. Even when arranged in a 2 x 3 configuration, the total footprint remains compact at 4mm x 4.9mm, surpassing the SMBB package in terms of package area efficiency.
Example of LED placement
Recommended Land Pattern/Metal Mask Aperture Pattern
Engineering Sample List
Single Junction Type
Dual Junction Series
* Models with “-X” in their part numbers are exclusive to prototypes and engineering samples, and the part numbers will change for mass production.
* Please note that this product is under development and may be subject to changes and modifications without prior notice.
Product and Engineering Sample Inquiries
We have a limited quantity of engineering samples available for the EDCC package.
For inquiries, please contact us here.