We are excited to announce that Ushio will exhibit our booth at the “2025 IEEE 75th Electronic Components and Technology Conference” in Dallas, TX!
For UV and lithography tools, come to Ushio! We are looking forward to seeing you there.
ECTC Official URL
ECTC | IEEE Electronic Components and Technology Conference
| Open period | May 27 (Tue) to May 30 (Fri), 2025. |
| Venue | Gaylord Texan Resort & Convention Center, Dallas, TX. |
| Booth No | 122 |
| Entrance fee | Charged (pre-registration required) |
| Official URL | ECTC | IEEE Electronic Components and Technology Conference |
Exhibit Details
Large-Field Projection Lithography System; UX-4, UX-5 series
Non-contact and extremely large shot size, capable of high productivity.
The lithography systems utilize Ushio’s field-proven lamp and optical technologies, along with unique large-field projection lens technology.
- UX-4 can expose up to 8-inch wafers non-contact, single shot per wafer. It enables exposure on bow/warped wafers using its wide D.O.F. (depth of focus), achieving high productivity and yield different from conventional aligners.
- UX-5 is designed as a stepper for advanced packaging substrates, capable of exposing full-panel (510x515mm) substrates in 4 shots.
[Key Technologies]
- Equipped with the world’s leading high-pressure UV lamp
- Unique optical system boasting high uniformity
- Outstanding large-area projection lens
- Large depth of focus for stable patterning
- Large shot enables high productivity
Digital Lithography Technology from Applied Materials and Ushio: “DLT”
The Lithography Solution for advanced packaging substrate applications.
The new DLT system is the only lithography technology that can achieve the resolution necessary for advanced substrate applications while delivering throughput levels required for high-volume production.
With the ability to pattern less than 2-micron line widths, the system enables the highest area density for chiplet architectures on any substrate, including wafers or large panels made of glass or organic materials.
Applied pioneered the technology behind the DLT system and will be responsible for R&D and definition of a scalable roadmap together with Ushio to enable continued innovation in advanced packaging to 1-micron line widths and beyond.
172nm Xe2* Excimer UV Technologies
The world’s highest irradiance and maximum exposure for high productivity.
Organic cleaning and surface modification are performed using 172-nm Vacuum UV (VUV) light and radicals generated by its high photon energy.
Surface modification can be performed without roughening the substrate surface, which contributes to improved adhesion of various materials.