We will exhibit our booth at “SEMICON West 2024” at Moscone Center, in San Francisco, USA from July 9th to July 11th, 2024.
There will be our exposure system, excimer irradiator, and heat sources (flash lamp annealing equipment, LED annealing equipment and halogen lamps) so please visit our booth! We are looking forward to seeing you there!
SEMICON West 2024 Official URL
Ushio Booth
| Open period | July 9 (Tue.) to July 11 (Thu.), 2024. |
| Venue | South Hall Moscone Center, San Francisco, USA |
| Booth No. | 548 |
| Official URL | https://expo.semi.org/west2024/Public/enter.aspx |
SEMICON West 2024 Exhibit Details
Excimer Light Irradiation Unit
The world’s highest irradiance and maximum exposure for unparalleled productivity!
Organic cleaning and surface reformulation are performed using vacuum ultraviolet light and radicals generated by itself.
Surface reformulation can be performed without roughening the substrate surface, which contributes to improved adhesion of various materials.
Flash Lamp Annealer
Ultra-short time annealing with high-power, wide-area irradiation, and precise control over the depth of heating in the target material.
This is an annealing (light heating and light sintering) device using a flashlamp. It can instantaneously heat large areas (up to 500×500mm) with high output. Compared to conventional electric furnaces and halogen lamp heating furnaces, it boasts high-precision temperature control along the depth direction of the workpiece.
The emitted spectrum ranges from ultraviolet to infrared, allowing for heating of various materials with absorption characteristics in that range.
In particular, if you are facing difficulties in temperature control during the heating process, it may be the optimal solution for you.
Large-Area Projection Exposure System; UX-4,UX-5 series
Non-contact and large shot-size, capable of high productivity.
The exposure systems utilize Ushio’s robust lighting and optical technologies, along with unique large-area projection lens technology.
・The UX-4 can expose up to 8-inch wafers non-contact, one shot per wafer. Enabling exposure on warped wafers using a wide focus depth, achieving high productivity and yield different from proximity aligners.
・The UX-5 is designed as a stepper for advanced packaging substrates, capable of exposing full-size (510x515mm) substrates in 4 shots.
【Key Technologies】
- Equipped with the world’s leading high-pressure UV lamp
- Unique illumination optical system boasting high uniformity
- Outstanding large-area projection lens
- Large depth of focus for stable patterning
- Large shot enables high productivity
Digital Lithography Technology from Applied Materials and Ushio 「DLT」
The Lithography Solution for advanced packaging substrate applications.
The new DLT system is the only lithography technology that can achieve the resolution necessary for advanced substrate applications while delivering throughput levels required for high-volume production.
With the ability to pattern less than 2-micron line widths, the system enables the highest area density for chiplet architectures on any substrate, including wafers or large panels made of glass or organic materials.
Applied pioneered the technology behind the DLT system and will be responsible for R&D and definition of a scalable roadmap together with Ushio to enable continued innovation in advanced packaging to 1-micron line widths and beyond.