ECTC 2024
We will exhibit our booth at the “2024 IEEE 74th Electronic Components and Technology Conference” in Denver from May 28 to May 31, 2024!
We will be exhibiting our exposure systems and excimer technologies, so please come visit us! We are looking forward to seeing you there.
▼ECTC Official URL
ECTC | IEEE Electronic Components and Technology Conference
Ushio Booth
| Open period | May 28(Tue.) to May 31(Fri.), 2024. | |
| Venue | Gaylord Rockies Resort & Convention Center 6700 N Gaylord Rockies Blvd Aurora, CO 80019-2198 Denver, Colorado | |
| Booth No | 433 | |
| Entrance fee | Charged (pre-registration required) | |
| Official URL | ECTC | IEEE Electronic Components and Technology Conference | |
【Exhibit Details】
Excimer Technologies
The world’s highest irradiance and maximum exposure for unparalleled productivity.
Organic cleaning and surface reformulation are performed using vacuum ultraviolet light and radicals generated by itself.
Surface reformulation can be performed without roughening the substrate surface, which contributes to improved adhesion of various materials.
Large-Area Projection Exposure System; UX-4, UX-5 series
Non-contact and large shot-size, capable of high productivity.
The exposure systems utilize Ushio’s robust lighting and optical technologies, along with unique large-area projection lens technology.
・The UX-4 can expose up to 8-inch wafers non-contact, one shot per wafer. It enables exposure on warped wafers using a wide focus depth, achieving high productivity and yield different from proximity aligners.
・The UX-5 is designed as a stepper for advanced packaging substrates, capable of exposing full-size (510x515mm) substrates in 4 shots.
【Key Technologies】
- Equipped with the world’s leading high-pressure UV lamp
- Unique illumination optical system boasting high uniformity
- Outstanding large-area projection lens
- Large depth of focus for stable patterning
- Large shot enables high productivity
Digital Lithography Technology from Applied Materials and Ushio 「DLT」
The Lithography Solution for advanced packaging substrate applications.
The new DLT system is the only lithography technology that can achieve the resolution necessary for advanced substrate applications while delivering throughput levels required for high-volume production.
With the ability to pattern less than 2-micron line widths, the system enables the highest area density for chiplet architectures on any substrate, including wafers or large panels made of glass or organic materials.
Applied pioneered the technology behind the DLT system and will be responsible for R&D and definition of a scalable roadmap together with Ushio to enable continued innovation in advanced packaging to 1-micron line widths and beyond.