UX-5 Series
Panel-Level Large Field Stepper
Ushio provides specialized steppers for FC-BGA and 2.xD packaging applications used in servers and PCs.
The stepper is intended for package substrates using a stage corresponding to the panel size and Ushio's proprietary large-area projection lens technology cultivated from many years of expertise in light source and optical technology. High productivity is achieved while realizing the high resolution and overlay accuracy required for the latest packaging substrates.
Component Technology
- Includes the world's best-selling super high-pressure UV lamp
- Ushio's irradiation optical system boasts a high degree of uniformity
- Unrivaled large-area projector lens
The stepper is intended for package substrates using a stage corresponding to the panel size and Ushio's proprietary large-area projection lens technology cultivated from many years of expertise in light source and optical technology. High productivity is achieved while realizing the high resolution and overlay accuracy required for the latest packaging substrates.
Component Technology
- Includes the world's best-selling super high-pressure UV lamp
- Ushio's irradiation optical system boasts a high degree of uniformity
- Unrivaled large-area projector lens
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Applications
- FC-BGA
- FC-CSP
- Interposer
- 2.1D
- 2.5D
- Packaging
- Semiconductor post-processing
- RDL
- Glass Panel Substrate
Features & Benefits
- Large field projection lens
Ushio's UX-5 can expose patterns up to 250 x 250 mm in a single shot. No stitching is required. This allows for maximum productivity even when handling large package sizes. - Suits a variety of alignment marks
Pattern matching algorithm does not require particular alignment marks, alignment can be achieved through a variety of trace, pad or via patterns. - High resolution
High resolution is obtained by using Ushio's projection lens "UPL series". It supports future design rules such as 5/5 μm and 3/3 μm Line/Space. - Large Depth of Focus
Due to the large depth of focus, even if warpage or unevenness in the panel cause focal deviation, the pattern profile is obtained. This feature is particularly effective for thick dry film resists or solder resists. - High-speed step-and-repeat by surface stages
Precision air bearings are used to reduce friction, and a plane motor configuration is used to reduce the weight of all moving parts and increase their rigidity. As a result, it is possible to perform high-speed step-and-repeat operations. In addition, the surface stage exerts feedback control using a laser interferometer. Consequently, high-speed operations, as well as superior positioning accuracy, can be achieved. - Elimination of mask damage
Since this is a non-contact projection exposure system, the mask and panel do not come into direct contact. This not only prevents trace pattern defects but also makes it possible to use the mask semipermanently, reducing running costs. Moreover, since the mask requires no cleaning, we expect improved equipment utilization compared to close contact exposure systems. - High overlay accuracy maintained despite panel deformation
The "auto scale function" compensates panel deformation by automatically changing the magnification up to 0.1%, greatly reducing the deviation in alignment.
UX-5 Series
| Model | Exposure Area | Substrate Size | Resolution | Throughput | Wavelength |
|---|---|---|---|---|---|
| UX-5881SC | 250 x 250 mm | 510 x 515 mm | 16 µm L/S | 120 panels/h | i+h line |
| UX-5894SC | 250 x 250 mm | 510 x 515 mm | 5 µm L/S | 120 panels/h | i line |
| UX-58112SC | 250 x 250 mm | 510 x 515 mm | 3 µm L/S | 120 panels/h | i line |
| UX-59113SE | > 100 x 100 mm | 510 x 515 mm | 1.5 μm L/S | TBD | i line |
Supports Future Design Rules
3μm L/S, 15μm thickness
Supports Substrate Shrinkage
Large Depth of Focus
