We’re excited to share that Ushio will be exhibiting at the 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) in Orlando, FL!
Stop by our booth to explore our latest UV and lithography technologies. We look forward to connecting with you in Orlando!
ECTC Official URL
ECTC | IEEE Electronic Components and Technology Conference
| Open period | May 26 (Tue) to May 29 (Fri), 2026. |
| Venue | JW Marriot & The Ritz-Carlton Grande Lakes Resort, Orlando, FL. |
| Booth No | 1105 |
| Entrance fee | Charged (pre-registration required) |
| Official URL | ECTC | IEEE Electronic Components and Technology Conference |
Exhibit Details
Large-Field Projection Lithography Systems: UX-4 & UX-5 Series
Non-contact, large-field exposure systems with extremely large shot size, enabling high productivity and stable performance.
Ushio’s lithography systems leverage field-proven lamp and optical technologies, combined with proprietary large-field projection lens design to deliver high-performance, large-area exposure.
- The UX-4 enables non-contact exposure of up to 8-inch wafers with single-shot processing per wafer. Its wide depth of focus (D.O.F.) supports reliable exposure of bow and warped wafers, improving both productivity and yield compared to conventional aligners.
- The UX-5 is designed as a stepper for advanced packaging applications, capable of exposing full-panel substrates (510 × 515 mm) in just four shots.
Key Technologies:
- World-leading high-pressure UV lamp
- High-uniformity optical system
- Large-area projection lens technology
- Wide depth of focus for stable patterning
- Large shot size for increased productivity
Learn more about UX Lithography Systems:
172nm Xe2* Excimer UV Technology
Featuring the world’s highest irradiance and maximum exposure for enhanced productivity.
Ushio’s 172 nm excimer technology enables high-efficiency organic cleaning and surface modification using high-energy vacuum UV light (VUV). This process improves surface properties without damaging or roughening the substrate, making it ideal for sensitive materials.
It enhances adhesion and improves performance in processes such as coating and bonding, supporting consistent, high-throughput manufacturing across a wide range of applications.
Learn more about 172 nm Excimer UV Technology
Ushio Presentations at ECTC 2026
USHIO will present one oral presentation and two poster presentations at ECTC 2026, showcasing advancements in exposure technology, bonding processes, and materials engineering for advanced packaging applications.
Oral Presentation
Schedule: Friday, May 29 at 9:50 AM
Title: First Demonstration of Stitching-Free Exposure Over an Ultra-Large 18-Reticle Area with High-Resolution 1.5 µm Line/Space on Glass Substrates
Authors: Naoya Sohara, Toshimitsu Arai, Ryotaro Takahashi, Naoki Gotou, Hirosuke Takamatsu
Poster Presentation (Interactive Session)
Schedule: Thursday, May 28, during the Interactive Presentation sessions (10:00 AM–12:00 PM or 2:30 PM–4:30 PM)
- Title: An Evaluation of Hybrid Bonding of Cu/SiO2 Using Vacuum Ultraviolet Light Under Redox Gases
Authors: Shinichi Endo, Kejun Wu, Kengo Nishio, Akihiro Shimizu
Session 39: Interactive Presentations – Bonding Processes and Analysis in Next Generation Interconnects
Poster No. 28 - Title: Room-Temperature Reduction of Molybdenum Oxide via 172-nm Vacuum Ultraviolet Irradiation in an H2/N2 Atmosphere with H2O Vapor
Authors: Akihiro Shimizu, Shinichi Endo
Session 40: Interactive Presentations – Materials, Manufacturing, and Assembly Techniques in Advanced Packaging Solutions
Poster No. 21